Soldering flux LTI-120 30ml Rexant 09-3625

Flux LTI-120 REXANT is designed to remove oxides from the surface before soldering, improve the flow of liquid solder, and protect stainless alloys, copper and its alloys, galvanized products, nichrome, lead, nickel, silver, cadmium, palladium, and bismuth from environmental effects. Manufactured in accordance with TU 84-406-73. This low-temperature flux is used for soldering and tinning parts in radio electronics. No cleaning is required after soldering: flux residues will serve as a protective coating for the soldered areas. If necessary, it can be dissolved with alcohol or acetone. Advantages: non-conductive, therefore widely used for soldering printed circuit boards and radio equipment; does not require cleaning after soldering; increases the strength of connections. Maximum activity temperature: +200...+300°C. Composition: pine rosin, binding liquid, triethanolamine, diethylamine hydrochloride. Packaging option – 30 ml bottle.