Soldering flux LTI-120 30ml (with brush) Rexant 09-3626

LTI-120 REXANT flux is designed to remove oxides from surfaces before soldering, improve the wetting of liquid solder, and protect stainless alloys, copper and its alloys, galvanized products, nichrome, lead, nickel, silver, cadmium, palladium, and bismuth from environmental exposure. Manufactured in accordance with TU 84-406-73. This low-temperature flux is used in soldering and tinning of components in radio electronics. No washing is required after soldering: flux residues will serve as a protective coating for the soldered areas. If necessary, it can be dissolved with alcohol or acetone. Advantages: non-conductive, therefore widely used in soldering printed circuit boards and radio equipment; increases the strength of connections. Maximum activity temperature: +200...+300°C. Composition: pine rosin, binding liquid, triethanolamine, diethylamine hydrochloride. Packaging option – 30 ml bottle. The cap is equipped with a brush for convenient application.