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REXANT SKF (spirit-rosin) flux is designed to remove oxides from the surface before soldering, improve the wetting of liquid solder, and protect against environmental effects when soldering printed circuit boards and radio components. Most effective when working with copper and its alloys. Manufactured in accordance with OST 4G 0.033.200. Often used for repairing radio equipment.
Maximum activity temperature: +150...+300°C. This flux is neutral, meaning it does not cause metal destruction, so no washing is required after soldering.
During storage at low temperatures, the formation of sediment is permitted, which does not affect the quality of the flux.
Main components: binding liquid and rosin. Packaging option – 30 ml bottle.
Packaging type
Vial/bottle
Design
Liquid
Corrosion-resistant
No
Volume
30 мл
Suitable for aluminum
No
Suitable for copper
Yes
Suitable for non-oxidized zinc
No
Suitable for stainless steel
No
Suitable for oxidised zinc
No
Suitable for drinking water
No
Suitable for lead
No
With brush
No
Washable with water
Yes
Packaging
Vial/bottle
0
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