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PV-209 powder soldering flux is used for high-temperature soldering of silver, copper, nickel, and their alloys. It removes oxide films and prevents their formation during the heating process. The use of the flux reduces the surface tension of the liquid solder and protects the metal in the soldering zone from external factors. Manufactured in accordance with GOST 23178-78.
It is convenient to apply the flux to the surfaces to be soldered in the form of a paste, which is obtained by mixing water and the powder mass (in a 1:1 ratio). The fluidity of the paste is adjusted by the amount of water.
The product is white, hygroscopic, fire-safe, and explosion-safe.
Soldering temperature: +700...+900 °C. Packaging option – jar with a lid, net weight 20 g. Applicable solder: medium-melting solders.
Composition: potassium fluoride: 42%-oxide; boron oxide: 35%; potassium tetrafluoroborate: 23%.
Design
Powder
Corrosion-resistant
No
Volume
20 мл
Suitable for aluminum
No
Suitable for copper
No
Suitable for non-oxidized zinc
No
Suitable for stainless steel
No
Suitable for oxidised zinc
No
Suitable for drinking water
No
Suitable for lead
No
With brush
No
Washable with water
Yes
Packaging
Can
0
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